WEBINAR REPLAY:
INTEGRATED THERMAL MANAGEMENT APPLICATIONS USING ANSYS ICEPAK
 
 
 
INTEGRATED
THERMAL
MANAGEMENT
APPLICATIONS
USING
ANSYS ICEPAK

 

Did you know that most cooling problems start with the original CAD model, yet the most challenging part of electronic cooling is typically the level of complexity of the geometry?

Let's say you're engineering a powerful motor and electronic controls in a compact, lightweight design. There's no doubt maintaining effective cooling is always going to be a challenging task.

 

Did you know that most cooling problems start with the original CAD model, yet the most challenging part of electronic cooling is typically the level of complexity of the geometry?

Let's say you're engineering a powerful motor and electronic controls in a compact, lightweight design. There's no doubt maintaining effective cooling is always going to be a challenging task.

 
REDUCE
SIMULATION
TIMES
 
HIGHLY
ACCURATE
SOLUTIONS
 
ADVANCED MESHING & SOLVER SCHEMES
 
REAL-WORLD
PRODUCT
VALIDATION
With multiple integrated circuit boards, a variety of components such as fans, heatsinks, and materials to furnish solutions - it's no wonder thermal management is becoming an essential component to understanding how a design can combat the generation of heat.
With multiple integrated circuit boards, a variety of components such as fans, heatsinks, and materials to furnish solutions - it's no wonder thermal management is becoming an essential component to understanding how a design can combat the generation of heat.
During this webinar replay, learn how electronic thermal management solutions leverage the ability to simulate rapid heat transfer, fluid flows for cooling strategies, ultimately helping your products avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centers, power electronics, and electric motors.
 
DURING THIS WEBINAR REPLAY,
WE WILL DEMONSTRATE HOW:
 
01
Thermal management simulation can be applied as we develop an aerospace drone
 
02
You can predict airflow, temperature, & heat transfer for electronic components using simulation
 
03
Ansys Icepak provides solutions for thermal management
 
04
& much more!
 

 

 

 
Watch this webinar replay to learn how electronic thermal management solutions leverage the ability to simulate rapid heat transfer, fluid flows for cooling strategies, ultimately helping your products avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centers, power electronics, and electric motors.
 
DURING THIS WEBINAR REPLAY,
WE WILL DEMONSTRATE HOW:
  • Thermal management simulation can be applied as we develop an aerospace drone
  • You can predict airflow, temperature, & heat transfer for electronic components using simulation
  • Ansys Icepak provides solutions for thermal management
  • & much more!